• Materials: CEM3, FR2, FR4 and Al

• Layers: 1 to 15

• Processes: HASL, Au plating, Au/SP immersion and OSP

• Remarkable effect of energy-saving

• Through-hole technology

• 1-stop station EMS services provider

• Fabrication, hand insertion, metal assembly and function test

• Conventional coatings: 0201, 0402, 0603, 0805, 1210 and 2512 placement

• BGA minimum precision: 0.5mm

• IC minimum precision: 0.4mm

• Experienced components sourcing team

• Specially for scarce parts

• 1 to 22 layers mixed assembly technology

• Available in various specifications

• Specialized in assembling boards for safety, industry control and power boards

• Type of production line and supports:

• SMT (Yamaha and Sanyo machine)

• Plastic injection factory

• Die-casting and sheet metal stamping factory

       ****Please visit Tecoo elcetronics Co.,Ltd on Global&Sources