• Laminate materials: FR-4, FR-1 or CME-1

• Test voltage: 150 to 300V

• Thickness:

• Copper: 0.5 to 10oz

• Base board: 0.3 to 4.0mm

• Surface finishing: OSP, HAL, Au immersion, silver,  soft Au, NEL plating and gold finger

• Number of layers: single-layer, double-layer and 4 to 10 layers

• Twist: 0.5%

• Insulation resistance: 10Ω (11Ω)

• Thermal cycling ability: 288 degrees Celsius and 5 seconds

• Finished board area: 560 x 610mm

• Minimum line width and spacing: 0.1 or 0.1mm

• Copper thickness in hole: 25.0μm

• Minimum pad diameter inner layer: 0.5mm

• Minimum hole diameter: 0.25mm

• Hole tolerance:

• PTH: +0.075mm

• NPTH: +0.05mm

• Hole location tolerance: +0.075mm

• Profile tolerance CNC routing: +0.15

• Profile tolerance CNC punching: +0.15

• Solder mask bridge ability: 0.1mm

• Solder mask rigidity: 6H

• Solderable test: 245°C and 5 seconds

• Incombustibility: 94V

• Packing:

• Inner: vacuum or plastic

• Outer: standard carton

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