Number of layers: single-layer, double-layer and 4 to 10

Copper thickness: 0.5 to 10oz

Laminate material: FR-4, FR-1 and CME-1

Base board thickness: 0.3 to 4.0mm

Surface finishing: OSP, HAL, immersion AU, silver, soft Au, nickel plating and gold finger

560 x 610mm finished area

Twist: 0.5%

Insulation resistance: 10 or 11MΩ

Test voltage: 150 to 300V

Thermal cycling ability 288C, 5 seconds

Finished board area: 560 x 610mm

Minimum line width and spacing: 0.1/0.1mm

Copper thickness in hole: 25.0μm

Minimum pad diameter inner layer: 0.5mm

Minimum hole diameter: 0.25mm

Hole tolerance:

PTH: +0.075mm

NPTH: +0.05mm

Hole location tolerance: +0.075mm

Profile tolerance CNC routing: +0.15mm

Profile tolerance CNC punching: +0.15mm

Solder mask bridge ability: 0.1mm

Solder mask rigidity: 6H

Solderable test: 245C, 5 seconds

Packing:

Inner: vacuum/plastic

Outer: standard carton