Number of layers: single, double and 4 to 10

Test voltage: 150 to 300V

Laminate material: FR-4, FR-1 and CME-1

Surface finishing: OSP, HAL, immersion AU, silver, soft Au, nel plating and gold finger

Copper thickness: 0.5 to 10oz

Base board thickness: 0.3 to 4.0mm

Twist: 0.5%

Thermal cycling ability 288C, 5 seconds

Minimum line width and spacing: 0.1/0.1mm

Copper thickness in hole: 25.0μm

Minimum pad diameter inner layer: 0.5mm

Minimum hole diameter: 0.25mm

Finished board area: 560 x 610mm

Hole tolerance:

PTH: +0.075mm

NPTH: +0.05mm

Hole location tolerance: +0.075mm

Profile tolerance CNC routing: +0.15

Profile tolerance CNC punching: +0.15

Solder mask bridge ability: 0.1mm

Solder mask rigidity: 6H

Solderable test: 245C, 5 seconds

Packing:

Inner: vacuum or plastic

Outer: standard carton