Laminate material: FR-4, FR-1 and CME-1

Surface finish: OSP, HAL, gold finger, silver, nel plating, immersion and soft Au

Test voltage: 150 to 300V

Copper thickness: 0.5 to 10 ounces

Base board thickness: 0.3 to 4.0mm

Twist: 0.5%

Finished board area: 560 x 610mm

Copper thickness in hole: 25Ω

Minimum line width and spacing: 0.1mm

Minimum pad diameter inner layer: 0.5mm

Minimum hole diameter: 0.25mm

Layers:

Single

Double

4 to 10

Hole tolerance:

PTH: +0.075mm

NPTH: +0.05mm

Hole location tolerance: +0.075mm

Profile tolerance:

CNC routing: +0.15

CNC punching: +0.15

Solder mask bridge ability: 0.1mm

Solder mask rigidity: 6H

Solderer test: 245C 5 seconds

Packing:

Inner: vacuum/plastic

Outer: standard carton